JPH0610697Y2 - 半導体スタック - Google Patents
半導体スタックInfo
- Publication number
- JPH0610697Y2 JPH0610697Y2 JP16691987U JP16691987U JPH0610697Y2 JP H0610697 Y2 JPH0610697 Y2 JP H0610697Y2 JP 16691987 U JP16691987 U JP 16691987U JP 16691987 U JP16691987 U JP 16691987U JP H0610697 Y2 JPH0610697 Y2 JP H0610697Y2
- Authority
- JP
- Japan
- Prior art keywords
- pair
- terminal plates
- flat
- terminal
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 31
- 238000001816 cooling Methods 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16691987U JPH0610697Y2 (ja) | 1987-10-30 | 1987-10-30 | 半導体スタック |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16691987U JPH0610697Y2 (ja) | 1987-10-30 | 1987-10-30 | 半導体スタック |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0171452U JPH0171452U (en]) | 1989-05-12 |
| JPH0610697Y2 true JPH0610697Y2 (ja) | 1994-03-16 |
Family
ID=31454739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16691987U Expired - Lifetime JPH0610697Y2 (ja) | 1987-10-30 | 1987-10-30 | 半導体スタック |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610697Y2 (en]) |
-
1987
- 1987-10-30 JP JP16691987U patent/JPH0610697Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0171452U (en]) | 1989-05-12 |
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